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A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer level system integration
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A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer level system integration | Semantic Scholar
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Keio University Global Page - For more information about the Keio CEMS MIM Programme, see: http://www.ic.keio.ac.jp/en/study/cems You can find more about CEMS worldwide at http://www.cems.org/. Please check out CEMS students' activities at
A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer leve
![MIM with Electronic Computer Hardware technology background. Abstract background with Electronic Integrated Circuit and MIM. Electronic Circuit Board Stock Photo - Alamy MIM with Electronic Computer Hardware technology background. Abstract background with Electronic Integrated Circuit and MIM. Electronic Circuit Board Stock Photo - Alamy](https://c8.alamy.com/comp/2H2YWA0/mim-with-electronic-computer-hardware-technology-background-abstract-background-with-electronic-integrated-circuit-and-mim-electronic-circuit-board-2H2YWA0.jpg)
MIM with Electronic Computer Hardware technology background. Abstract background with Electronic Integrated Circuit and MIM. Electronic Circuit Board Stock Photo - Alamy
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A microphotograph of the front-end IC with on-chip SrTiOs MIM capacitor. | Download Scientific Diagram
RF, DC, and reliability characteristics of ALD HfO/sub 2/-Al/sub 2/O/sub 3/ laminate MIM capacitors for Si RF IC applications
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a) device structure with typical MIM sandwich structure; (b) the set... | Download Scientific Diagram
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